td62308ap/f/af 2003-02-26 1 toshiba bipolar digital integrated circuit silicon monolithic td62308ap,td62308f,TD62308AF 4ch low input active high ? current darlington sink driver the td62308ap/f/af is a non ? inverting transistor array which is comprised of four npn darlington output stages and pnp input stages. this device is low ? level input active driver and is suitable for operation with 5 ? v ttl, 5 ? v cmos and 5 ? v microprocessor which have sink current output drivers. application include relay, hammer, lamp and stepping motor drivers. features output current (single output) 1 .5 a (max) high sustaining voltage output 35 v (min) (td62308f) 50 v (min) (td62308ap, TD62308AF) output clamp diodes input compatible with ttl and 5 v cmos low level active inputs standard supply voltage two v cc terminals v cc 1 , v cc2 (separated) gnd and sub terminal = heat sink package type ? ap : dip ?1 6 pin package type ? f, af : hsop ?1 6 pin pin connection (top view) td62308ap td62308f, TD62308AF weight dip16 ? p ? 300 ? 2.54a : 1.11 g (typ.) hsop16 ? p ? 300 ? 1.00 : 0.50 g (typ.)
td62308ap/f/af 2003-02-26 2 schematics (each driver) note : the input and output parasitic diodes cannot be used as clamp diodes. precautions for using ( 1 ) this ic does not include built-in protection circuits for excess current or overvoltage. if this ic is subjected to excess current or overvoltage, it may be destroyed. hence, the utmost care must be taken when systems which incorporate this ic are designed. utmost care is necessary in the design of the output line, vcc, common and gnd line since ic may be destroyed due to short ? circuit between outputs, air contamination fault, or fault by improper grounding. (2) if a td62308ap/f/af is being used to drive an inductive load (such as a motor, solenoid or relay), toshiba recommends that the diodes (pins 9 and 1 6) be connected to the secondary power supply pin so as to absorb the counter electromotive force generated by the load. please adhere to the device?s maximum ratings. toshiba recommends that zener diodes be connected between the diodes (pins 9 and 1 6) and the secondary power supply pin (as the anode) so as to enable rapid absorption of the counter electromotive force. again, please adhere to the device?s maximum ratings. maximum ratings (ta = 25c) characteristic symbol rating unit supply voltage v cc ? 0.5~10 v f ? 0.5~35 output sustaining voltage ap, af v ce (sus) ? 0.5~50 v output current i out 1.5 a / ch input current i in ? 10 ma input voltage v in ? 0.5~30 v f 35 clamp diode reverse voltage ap, af v r 50 v clamp diode forward current i f 1.5 a ap 1.47 / 2.7 (note 1) power dissipation f, af p d 0.9 / 1.4 (note 2) w operating temperature t opr ? 40~85 c storage temperature t stg ? 55~150 c note 1: on glass epoxy pcb (50 50 1.6 mm cu 50%) note 2: on glass epoxy pcb (60 30 1.6 mm cu 50%)
td62308ap/f/af 2003-02-26 3 recommended operating conditions (ta = ? 40~85c) characteristic symbol condition min typ. max unit supply voltage v cc D 4.5 D 5.5 v f D 0 D 35 output sustaining voltage ap, af v ce (sus) D 0 D 50 v dc 1 circuit, ta = 25c 0 D 1250 duty = 10% 0 D 1250 ap duty = 50% 0 D 700 duty = 10% 0 D 1250 output current f, af i out t pw = 25 ms 4 circuits ta = 85c t j = 120c duty = 50% 0 D 390 ma / ch input voltage v in D 0 D 25 v output on v in (on) D 0 D v cc ? 3.6 input voltage output off v in (off) D v cc ? 1.0 D v cc v f D D D 35 clamp diode reverse voltage ap, af v r D D D 50 v clamp diode forward current i f D D D 1.25 a ap ta = 85c (note 1) D D 1.4 power dissipation f, af p d ta = 85c (note 2) D D 0.7 w note 1: on glass epoxy pcb (50 50 1.6 mm cu 50%) note 2: on glass epoxy pcb (60 30 1.6 mm cu 50%)
td62308ap/f/af 2003-02-26 4 electrical characteristics (ta = 25c) characteristic symbol test cir ? cuit test condition min typ. max unit v ce = 50 v, ta = 25c D D 50 ap, af v ce = 50 v, ta = 85c D D 100 v ce = 35 v, ta = 25c D D 50 output leakage current f i cex 1 v ce = 35 v, ta = 85c D D 100 a i out = 1.25 a D D 1.8 output saturation voltage v ce (sat) 3 i out = 0.7 a D D 1.3 v "h" level v ih D D v cc ? 1.6 D 25 input voltage "l" level v il D D D D v cc ? 3.6 v "h" level i ih D D 10 a input current "l" level i il D D D ? 0.05 ? 0.36 ma ap, af v r = 50 v, ta = 25c D D 50 clamp diode reverse current f i r 4 v r = 35 v, ta = 25c D D 50 a clamp diode forward voltage v f 5 i f = 1.25 a D 1.5 2.0 v output on i cc (on) v cc = 5.5 v, v in = 0 v D 8.5 12.5 ma / ch supply current output off i cc (off) 2 v cc = 5.5 v, v in = v cc D D 1.0 a f v out = 35 v r l = 28 ? turn ? on delay ap, af t on v out = 50 v r l = 40 ? D 0.2 D f v out = 35 v r l = 28 ? turn ? off delay ap, af t on 6 c l = 15 pf v out = 35 v r l = 40 ? D 5.0 D s
td62308ap/f/af 2003-02-26 5 test circuit 1 . i cex 2. i cc 3. v ce (sat) 4. ir 5. v f 6. t on t off note 1: pulse width 50 s, duty cycle 10% output impedance 50 ? tr 5 ns, tf 10 ns note 2: cl includes probe and jig capacitance.
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td62308ap/f/af 2003-02-26 8 package dimensions dip16 ? p ? 300 ? 2.54a unit: mm weight: 1.11 g (typ.)
td62308ap/f/af 2003-02-26 9 package dimensions hsop16 ? p ? 300 ? 1.00 unit: mm weight: 0.50 g (typ.)
td62308ap/f/af 2003-02-26 10 toshiba is continually working to improve the quality and reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. the products described in this document are subject to the foreign exchange and foreign trade laws. the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba corporation for any infringements of intellectual property or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any intellectual property or other rights of toshiba corporation or others. the information contained herein is subject to change without notice. 000707eb a restrictions on product use
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